Stencil computation is an important class of algorithms used in a large variety of scientific-simulation applications. The performance of stencil calculations is often bounded by memory bandwidth. High-bandwidth memory (HBM) on devices such as those in the Intel Xeon Phi x200 processor family (code-named Knights Landing) can thus provide additional performance. In a traditional sequential time-step approach, the additional bandwidth can be best utilized when the stencil data fits into the HBM, restricting the problem sizes that can be undertaken and under-utilizing the larger DDR memory on the platform. As problem sizes become significantly larger than the HBM, the effective bandwidth approaches that of the DDR, degrading performance. This paper explores the use of temporal wave-front tiling to add an additional layer of cache-blocking to allow efficient use of both the HBM bandwidth and the DDR capacity. Details of the cache-blocking and wavefront tiling algorithms are given, and results on a Xeon Phi processor are presented, comparing performance across problem sizes and among four experimental configurations. Analyses of the bandwidth utilization and HBM-cache hit rates are also provided, illustrating the correlation between these metrics and performance. It is demonstrated that temporal wave-front tiling can provide a 2.4x speedup compared to using HBM cache without temporal tiling and 3.3x speedup compared to only using DDR memory for large problem sizes.